L531-R high-speed vertical dispenser

Introduction:

The L531-R jet high-speed dispensing machine is an equipment independently developed, designed and produced by Shirui, which brings customers innovative small-volume high-speed automatic online dispensing solutions. This equipment can be produced by a single machine or can be added with a board. /Unloading board/Connecting machine is used in production line to automatically feed in and out materials. In addition to standard products, highly experienced Shirui engineers can also customize solutions for customers to solve customers' unique application needs

main feature:

1. Automatic online glue spraying, automatic feeding and discharging

2. Non-contact jet technology eliminates Z-axis movement to achieve precise positioning in the height direction

3. The glue amount automatic compensation system adopts ultra-high precision balance.

4. Non-contact laser height measurement technology, automatically detects the height of the product, and automatically adjusts the height of the glue.

5. The flying high-speed shooting technology is a position trigger method with 120 frames of images per second.

6. Flying glue control mode can avoid position deviation and vibration problems

7. Mature software control system, friendly man-machine interface program.

8. The upgradeable automatic dispensing control platform is convenient to change the configuration to meet the needs of product diversification and product enhancement

Application range:

1. PCB board assembly: fine coating, underfilling, mounting and bonding, solder paste distribution

2. Microelectronics packaging: flip chip, wafer connection, chip encapsulation, dam filling

3. LED packaging: dot phosphor, cavity encapsulation

Recommended fluid:

• SMT adhesives (covering conductive adhesives containing hard particles)

• Silicone

• LED phosphor

• Underfill

• Hot melt glue

• Solder paste

• UV glue etc.

Main configuration and specification parameters:

High-precision jet dispensing piezoelectric valve, automatic feeding and discharging system, three-axis motion system, product in-place fixing system, automatic glue cleaning system and automatic test alignment, automatic weighing system, digital visual recognition system, glue level sensor , On-line communication system, non-contact height sensor, glue weight automatic compensation system, reference point identification.

THRAY case (chip package dam filling )

THRAY case (CCM module chip packaging)

THRAY case (CCMUV paste)

THRAY case (CCM seal)

THRAY case (CCM through hole sealing)